HEAT CAPACITIVE COMPONENT CARRIER AND METHOD TO PRODUCE SAID COMPONENT CARRIER

The invention refers to a component carrier (10) realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat- passage component (30), said at least one heat-passage component (30) being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer (21, 22) or is embedded within at least one inner layer (23, 24) of the component carrier (10), and further comprising at least one latent-heat storage unit (40) with a phase-change material (45). The phase-change material (45) is laminated and integrated within at least one cavity (25) of the component carrier (10) and is directly thermoconductively coupled with the at least one heat-passage component (30). The invention also refers to a method for producing said component carrier (10).