Laser diode package with enhanced cooling

专利类型: 
相变材料专利导航
公开(公告)号: 
US8208509B2
申请日: 
2011-08-04
申请局: 
US
摘要: 
A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
原始专利权人: 
DERI ROBERT J | KOTOVSKY JACK | SPADACCINI CHRISTOPHER M | L LIVERMORE NAT SECURITY LLC
受让人: 
U.S. DEPARTMENT OF ENERGY
当前专利权人: 
Lawrence Livermore National Security LLC