Bonding material and phase change material system for heat burst dissipation

There is disclosed herein an electronic circuit assembly using a bonding material/phase change material system for electronic device heat burst dissipation. One embodiment of the assembly comprises: a substrate having a substrate surface with a preselected mounting site located thereon; a predetermined amount of phase change material disposed on the substrate surface at the preselected mounting site; a predetermined amount of bonding material arranged on the substrate surface at the preselected mounting site so as to substantially surround the predetermined amount of phase change material; and an electronic device having a heatspreader portion, the device being oriented such that the heatspreader portion is positioned at the preselected mounting site over the predetermined amounts of phase change material and bonding material, the heatspreader portion being attached to the substrate surface by the bonding material.