HEAT DISSIPATION COMPONENT

专利类型: 
相变材料专利导航
公开(公告)号: 
US20140311713A1
申请日: 
2013-08-12
申请局: 
US
摘要: 
A heat dissipation component includes a first film, a second film, and a working fluid. The second film is connected with a part of the first film to form a plurality of vein channels. The vein channels include a main vein channel and a plurality of branch vein channels, and the main vein channel is connected with the branch vein channels. The working fluid is disposed in the vein channels. The heat dissipation component is bendable to be easily assembled with an electronic device. The working fluid may flow in the vein channels via a pressure difference generated by a phase transition, gravity, and a capillary effect, or via a pressure difference generated, by a pulse generator to transfer the heat to the whole heat dissipation component. The first film and the second film may have heat conduction material to improve the heat transfer rate.
原始专利权人: 
ASUSTEK COMPUTER INC.
受让人: 
ASUSTEK COMPUTER INC.
当前专利权人: 
Asustek Computer Inc