Phase change materials for cooling enclosed electronic components, including for solar energy collection, and associated systems and methods

The present technology is directed generally to phase change materials for cooling enclosed electronic components, including for solar energy collection, and associated systems and methods. In particular embodiments, a system directs warm air through an airflow path in thermal communication with a phase change material to liquefy the phase change material and cool the air. The system also directs the cool air into thermal communication with electronic components to cool the electronic components via conduction and/or convection.