RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

专利类型: 
相变材料专利导航
公开(公告)号: 
US20210261706A1
申请日: 
2019-06-27
申请局: 
US
摘要: 
An aspect of the present invention provides a resin composition containing an acrylic resin which is obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a block isocyanate group.(In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms.)
原始专利权人: 
SHOWA DENKO MATERIALS CO., LTD.
受让人: 
SHOWA DENKO MATERIALS CO., LTD. | RESONAC CORPORATION
当前专利权人: 
Resonac Corp