专利类型:
相变材料专利导航
公开(公告)号:
US6926955B2
申请日:
2002-02-08
申请局:
US
摘要:
According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.
原始专利权人:
JAYARAMAN SAIKUMAR | KONING PAUL A. | DANI ASHAY
受让人:
INTEL CORPORATION
当前专利权人:
Intel Corp