专利类型:
阳极产品开发专利导航
公开(公告)号:
CA2311724A1
申请日:
2000-06-15
申请局:
CA
摘要:
A compound electrode (1) incorporating a lead substrate utilizes the lead as a supportstructure (5). This support structure (5) provides a surface that engages a mesh member(2), e.g., a valve metal expanded metal mesh. The mesh member (2) has a front (6) andback surface with the back surface facing the lead support structure (5). At least the frontsurface (10) of the mesh member (2) is an active surface. Securing of the mesh member(2) to the lead support structure (5) in electrical connection permits the lead supportstructure (5) to serve as a current distributor for the mesh member (2). The mesh member(2) may engage the surface (6) of the lead support structure (5) as by pressing or rollingthe mesh on to the lead. Other engagement means can include the use of fasteners, orwelding and the like. The resulting structure can be particularly useful as an electrode (3)assembly for use in an electrolytic cell that serves for the electrowinning of a metal.
原始专利权人:
ELTECH SYSTEMS CORPORATION
当前专利权人:
Eltech Systems Corp