专利类型:
阳极产品开发专利导航
公开(公告)号:
US6139705A
申请日:
1999-03-22
申请局:
US
摘要:
A compound electrode incorporating a lead substrate utilizes the lead as a support structure. This support structure provides a surface that engages a mesh member, e.g., a valve metal expanded metal mesh. The mesh member has a front and back surface with the back surface facing the lead support structure. At least the front surface of the mesh member is an active surface. Securing of the mesh member to the lead support structure in electrical connection permits the lead support structure to serve as a current distributor for the mesh member. The mesh member may engage the surface of the lead support structure as by pressing or rolling the mesh onto the lead. Other engagement means can include the use of fasteners, or welding and the like. The resulting structure can be particularly useful as an electrode assembly for use in an electrolytic cell that serves for the electrowinning of a metal.
原始专利权人:
ELTECH SYSTEMS CORP
受让人:
ELTECH SYSTEMS CORPORATION | MELLON BANK, N.A., AS AGENT | LASALLE BANK NATIONAL ASSOCIATION | ELTECHSYSTEMS CORPORATION
当前专利权人:
Eltech Systems Corp