PB ALLOY SUPPRESSING GENERATION OF IMPURITY IN PLATING

PURPOSE: To prevent a material to be plated from eluting in a molten plating path and plating property from deteriorating by incorporating a specific small amt. of Te, P, As, etc. in a molten Pb-Sn alloy plating bath or a Pb-Sn alloy plating bath contg. Sb. CONSTITUTION: The surface of an iron or steel, stainless steel or a non-ferrous alloy of copper, copper-zinc, etc. is subjected to hot dipping of a Pb-Sn alloy for the purpose of improving the corrosion resistance on said surface. A Pb-Sn alloy contg. 0.3W65% Sn or further 0.1W3% Sb and consisting of the balance Pb is used for the hot dipping bath to be used in this case and further 1 or ≥2 kinds among 0.001W0.1% Fe, 0.001W0.12% P and 0.03W0.2% As are added thereto. The generation of a defect such as rough surface on the plating surface by the elution of Fe and Cu in the plating material owing to the reiterative use of the hot dipping bath is prevented and the wettability of the plating bath in the stage of plating as well as the resistance of the plating surface to corrosion and oxidation are improved.COPYRIGHT: (C)1984,JPO&Japio