Encapsulated phase change material heat sink and method

According to an embodiment of the disclosure, an encapsulated phase change material (PCM) heat sink is provided. The encapsulated PCM heat sink includes a lower shell, an upper shell, an encapsulated phase change material, and an internal matrix. The internal matrix includes a space that is configured to receive the encapsulated phase change material. Thermal energy is transferrable between the encapsulated phase change material and at least one of the lower shell and the upper shell. For a particular embodiment, the upper shell is coupled to the lower shell at room temperature and room pressure.