HOT MELT ADHESIVE CONTAINING PHASE CHANGING MATERIALS

Disclosed is a hot melt adhesive composition comprising a hot melt adhesive in combination with a phase change material. The phase change material provides thermal regulatory characteristics to the hot melt adhesive. Preferably the phase change material is a microencapsulated organic wax having a melting temperature of from 5 to 80º C and a latent heat of fusion of from 40 to 300 Joules/gram. The addition of the phase change material increases the storage modulus, viscosity and enthalpy of the hot melt adhesive composition while maintaining the adhesive strength of the hot melt adhesive. The phase change materials find use in any hot melt adhesive composition.