Techniques for computing device cooling using a self-pumping fluid

专利类型: 
相变材料专利导航
公开(公告)号: 
US9326422B2
申请日: 
2011-12-13
申请局: 
US
摘要: 
Techniques for computing device cooling using a self-pumping cooling fluid are described. For example, an apparatus may comprise one or more heat-generating components, a housing forming a cavity including the one or more heat-generating components, and a self-pumping cooling fluid arranged in the cavity. The self-pumping cooling fluid may comprise a slurry of microencapsulated phase change material (mPCM) particles suspended in a working fluid and arranged to circulate throughout the cavity. Other embodiments are described.
原始专利权人: 
Mark MacDonald
受让人: 
INTEL CORPORATION
当前专利权人: 
Intel Corp