Microencapsulated phase change material slurry heat sinks

A slurry of micro-encapsulated phase change materials is provided in accordance with the present invention as a heat sink for, for example, the thermal management of electronic components. The slurry of micro-encapsulated phase change material may be provided within an open container and the electronic component immersed therein. In the alternative, the slurry of micro-encapsulated phase change material can be provided within a container of either flexible bag-like design or a relatively rigid preformed structure to be mounted adjacent the article to be thermally controlled.