蓄熱材マイクロカプセル、蓄熱材マイクロカプセル分散液および蓄熱材マイクロカプセル固形物

专利类型: 
相变材料专利导航
公开(公告)号: 
JP4845576B2
申请日: 
2006-04-14
申请局: 
JP
摘要: 
<P>PROBLEM TO BE SOLVED: To provide a heat storage material microcapsule which does not use harmful formalin and is excellent in heat resistance and solvent resistance. <P>SOLUTION: This heat storage material microcapsule encapsulating a heat storage material is characterized in that a resin constituting the coating film of the microcapsule is a resin obtained by reacting a polyvalent isocyanate compound with a polymer amine compound. <P>COPYRIGHT: (C)2008,JPO&INPIT
原始专利权人: 
三菱製紙株式会社
当前专利权人: 
Mitsubishi Paper Mills Ltd