专利类型:
相变材料专利导航
公开(公告)号:
JP4845576B2
申请日:
2006-04-14
申请局:
JP
摘要:
<P>PROBLEM TO BE SOLVED: To provide a heat storage material microcapsule which does not use harmful formalin and is excellent in heat resistance and solvent resistance. <P>SOLUTION: This heat storage material microcapsule encapsulating a heat storage material is characterized in that a resin constituting the coating film of the microcapsule is a resin obtained by reacting a polyvalent isocyanate compound with a polymer amine compound. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT
原始专利权人:
三菱製紙株式会社
当前专利权人:
Mitsubishi Paper Mills Ltd