SUPPORT FRAME WITH INTEGRATED PHASE CHANGE MATERIAL FOR THERMAL MANAGEMENT

A solution to provide heat management and cooling for electronic devices. Heat produced during the operation of the processing components in the computing device is absorbed by heat management structures (123) integrated within a supporting mid-frame (103). The heat management structures (123) include phase change materials that allow the processing components to be kept at an isothermal state through changing in phase, thereby prolonging the duration of time in which the processing components can operate at high performance level without the need to throttle the performance.