Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition

A solid polyhydric alcohol material (16) is provided in thermal contact with an electronic component (14) which will be damaged if its temperature rises above a certain value. The material (16), known as a phase change material (PCM), exhibits an isothermal solid-solid phase transition at a predetermined temperature (T1) below which damage to the component (14) will not occur. Heat generated by the component (14) and its environment causes the temperature of the component (14) and the PCM (16) to increase to the transition temperature (T1). Further generated heat is absorbed by the PCM (16) as latent heat and causes a phase transition, such that no further increase in temperature occurs. This arrangement prevents the temperature of the component (14) from rising above the transition temperature (T1) under transient thermal overload conditions.