RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

专利类型: 
相变材料专利导航
公开(公告)号: 
US20210246349A1
申请日: 
2019-05-10
申请局: 
US
摘要: 
An aspect of the present invention is a resin composition containing an acrylic resin obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer copolymerizable with the first monomer and having a reactive group.[In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.]
原始专利权人: 
SHOWA DENKO MATERIALS CO., LTD.
受让人: 
SHOWA DENKO MATERIALS CO., LTD. | RESONAC CORPORATION
当前专利权人: 
Resonac Corp