Thermal Management of Implantable Medical Devices

专利类型: 
相变材料专利导航
公开(公告)号: 
US20090082832A1
申请日: 
2008-09-25
申请局: 
US
摘要: 
Systems and techniques for thermal management of implantable medical devices. In one aspect, an implantable device adapted for implantation in a body includes a conductor component that conducts an electrical current in response to the body in which that implantable device is implanted being subjected to an alternating electromagnetic field and a thermal management component in thermal contact with the conductor component and configured to manage excess heat generated by the conduction of the electrical current. The thermal management component comprises a material that undergoes a phase transition at a temperature above the temperature of the body in which the implantable device is adapted to be implanted.
原始专利权人: 
BOSTON SCIENT NEUROMODULATION
受让人: 
BOSTON SCIENTIFIC NEUROMODULATION CORPORATION
当前专利权人: 
Boston Scientific Neuromodulation Corp