SYSTEM FOR COOLING ELECTRONIC DEVICE

专利类型: 
相变材料专利导航
公开(公告)号: 
US20130333414A1
申请日: 
2011-07-05
申请局: 
US
摘要: 
A system for cooling an electronic device of the present invention cools air warmed by exhaust heat of an electronic device, and includes an evaporator, a condenser, a gas flow channel, and a liquid flow channel. The evaporator is provided in a direction in which air is blown out by the electronic device, and causes a liquid coolant to undergo a phase transition to a gaseous coolant by absorbing heat of the air blown out from the electronic device. The condenser causes the gaseous coolant to undergo a phase transition to a liquid coolant by releasing heat of the gaseous coolant. The gas flow channel flows the gaseous coolant undergone the phase transition by the evaporator, into the condenser. The liquid flow channel flows the liquid coolant undergone the phase transition by the condenser, into the evaporator. The condenser is arranged above the evaporator.
原始专利权人: 
Kenichi Inaba | Minoru Yoshikawa
当前专利权人: 
Kenichi Inaba | Minoru Yoshikawa