专利类型:
相变材料专利导航
公开（公告）号:
US20210293489A1
申请日:
2021-05-06
申请局:
US
摘要:
An object of the present invention is to provide a heat storage sheet in which the occurrence of defects when handling it is suppressed, and a heat storage member and an electronic device including the heat storage sheet.The heat storage sheet according to an embodiment of the present invention includes a microcapsule which encapsulates a heat storage material, in which a void volume is less than 10% by volume.
原始专利权人:
FUJIFILM CORPORATION
受让人:
FUJIFILM CORPORATION
当前专利权人:
Fujifilm Corp