LIQUID-HEATED MOLD AND METHOD OF USING SAME

The present system is configured to absorb, using a fluid medium in a reservoir, electromagnetic radiation to heat the fluid medium. The fluid medium may then conduct heat into a mold cavity formed by interior mold surfaces of at least two mold pieces. The fluid medium may heat up to, but not beyond, a phase transition temperature of the fluid medium, reducing instances of accidental damage to moldable material in a mold cavity during thermally-accelerated curing of the moldable material. In some instances a mold may be placed in liquid contained by the reservoir. In some instances, a mold may have integral reservoirs in individual mold pieces.